Processing Machine×大船企業日本 - List of Manufacturers, Suppliers, Companies and Products

Processing Machine Product List

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Individual Axis Drive Profile Machining Machine 'ECO-RM Series'

Suppressing substrate warping, high-precision notching processing is also possible! Automatic correction for each axis independently during processing.

The "ECO-RM Series" is a contour processing machine with individually driven axes that can perform high-precision contour machining for patterns. With axis alignment correction, it automatically compensates for the expansion and rotation of the substrate on a per-axis basis (when equipped with a CCD camera). The machine itself drills reference holes and sets internal pins for securing the substrate, allowing for high-precision alignment processing for each piece when used in conjunction with the axis alignment correction function. 【Features】 ■ Axis Alignment Correction - Automatically compensates for the expansion and rotation of the substrate on a per-axis basis - Enables high-precision contour machining for patterns ■ Automatic Pin Insertion Function (Optional) - The machine itself drills reference holes and sets internal pins for securing the substrate - Allows for high-precision alignment processing for each piece *For more details, please refer to the PDF document or feel free to contact us.

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Laser Processing Machine Multi-Purpose Single-Axis Laser Processing Machine [New Product]

Multi-purpose single-axis laser processing machine for new products! We provide support from the development of processing technology for new materials to the sale of production machines (custom orders available).

The multi-purpose single-axis laser processing machine was first showcased as a real machine at 'JPCA 2022' by the Japanese company Ofuna. Customers can customize the laser oscillator and table specifications according to their processing applications and materials, making it a made-to-order product. We own various types of 'multi-purpose single-axis laser processing machines,' including UV (nanosecond, picosecond) and CO2 lasers, allowing us to provide consistent support from the development of processing technologies for new materials to the sale of production machines. ■ Examples of processing with UV lasers: Processing of micro-diameter holes in ABF materials (package substrates), processing of micro-diameter holes in PI materials (flexible substrates), small-diameter hole processing in SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 lasers: TH processing of Cu2um double-sided boards, BH processing of Cu2um multilayer boards, and new materials compatible with high frequency and 5G, such as fluororesins, liquid crystal polymers, and PPE resins. *For more details, please refer to the PDF materials or feel free to contact us. *We also have various examples of processing applications, so please check the PDF materials.

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